Friday, July 26, 2013

More iPhone 5S parts leak as mass production gets underway

iPhone 5S Leak Motherboard

A new leak has revealed a key component for Apple?s next-generation iPhone. Images from repair shop iHospital?reportedly show the motherboard for the iPhone 5S. The component is similar to the one found in the iPhone 5, although there are slight differences that suggest we may see new hardware in Apple?s upcoming smartphone. Earlier reports claimed that the iPhone 5S will be equipped with a faster A6 processor, improved graphics, 2GB of RAM and a 12-megapixel camera with a dual-LED flash. It may also include a fingerprint scanner for increased security, an NFC chip and an upgraded LTE radio. Apple is expected to release the iPhone 5S sometime this fall. The leaked images follow below.

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PCB-iPhone-5S-1

This article was originally published on BGR.com

Source: http://news.yahoo.com/more-iphone-5s-parts-leak-mass-production-gets-141533386.html

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